PCB Design & Manufacturing

Service 04 · PCB design & manufacturing

From schematic to tested board.

Our engineers design every board in-house in Altium Designer and Cadence. Qualified partners fabricate and assemble it under Lorentis quality oversight. Then we bring it up and test it in our lab.

Discuss your board →Watch it being built
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Altium++ Cadence Allegro / OrCAD
HDIMultilayer, HDI and rigid-flex
SI/PISignal and power integrity
Class 3IPC-A-610 high-reliability
TWQualified partners in Taiwan
01 · Design

Engineers who design for the first spin to work.

Schematic, layout and analysis are done by the same in-house team, so design intent never gets lost in a hand-off.

  • Schematic capture with component selection, derating and lifecycle checks
  • Multilayer, HDI and rigid-flex layout with controlled impedance
  • High-speed routing: DDR4, PCIe, multi-gigabit SerDes, JESD204
  • RF layout for datalinks, radios and EW front-ends
  • DFM, DFT and DFA reviews with the fabricator before release
Altium DesignerCadence AllegroOrCAD CaptureSigrity SI / PIODB++ · IPC-2581
Engineer designing electronics on a laptop in a labDesign team
Design and lab under one roofLayout engineers work next to the bench where the board will be tested.
02 · Inside the board

Every layer engineered.

A high-speed board is a precise stack of copper and dielectric. We define the stack-up, impedance and via structure with the fabricator before routing begins.

8-LAYER HDI STACK-UP · ILLUSTRATIVE
03 · Manufacturing

Built on a production line, inspected at every step.

Fabrication and assembly run at qualified partners in Taiwan to IPC-A-610 Class 3, under our quality oversight. Follow a board from bare panel to tested assembly.

SMT ASSEMBLY LINE · ILLUSTRATIVE
Automated machine over a circuit boardAutomation
Automated assemblyPrecision placement and dispensing.
Technician handling circuit board panelsProduction
Panel handling & inspectionTraceability for every panel and lot.
Assembled circuit boardsAssembled
Prototype to low-volumeFrom first articles to production batches.
04 · Test & bring-up

Tested in our lab before it reaches you.

Every new design is brought up by the engineers who designed it. We measure power rails, clocks and high-speed links against the analysis, then run functional tests.

  • Power-up and rail validation with sequencing checks
  • High-speed link validation: eye diagrams, BER, jitter
  • Boundary-scan and functional test fixtures
  • Thermal and environmental screening on request
EYE DIAGRAM · ILLUSTRATIVE
PCB layout on screen next to an oscilloscopeLab
Layout meets measurementLayout and oscilloscope side by side during bring-up.
Engineer inspecting a board under a microscopeInspection
Microscope inspectionSolder joints checked against IPC-A-610.
05 · The process

Eight gated steps, one team.

01

Requirements

Interfaces, environment, form factor, standards

02

Schematic

Component selection, derating, reviews

03

Stack-up & layout

Impedance, placement, routing

04

SI / PI analysis

Simulation before release

05

DFM release

Gerber / ODB++ with the fabricator

06

Fab & assembly

Partners in Taiwan, IPC Class 3

07

Bring-up & test

In our lab in Istanbul

08

Production

Low-volume builds and lifecycle support

IPC-2221IPC-6012 Class 3IPC-A-610 Class 3IPC J-STD-001MIL-STD-810MIL-STD-461
Start your board

Send us your block diagram.

We will come back with a stack-up proposal, a schedule and a quote for design, fabrication and assembly.

  • In-house design in Altium and Cadence
  • Fabrication and assembly with qualified partners
  • Bring-up and test in our lab
  • Teknopark İstanbul